■ ⾼性能355nm紫外激光器，激光光束质量稳定，聚焦光斑⼩，可实现超精细打标。

■ 光路采⽤封闭式设计，安全性⾼；使⽤寿命⻓，维护成本低

■ 主要应⽤精密部件、汽⻋控制元件、薄⽚陶瓷、半导体晶⽚、IC晶粒、 蓝宝⽯等材料的精细打标，精细切割

■ 有⼯作台和便携分体式两款可选，体积⼩巧紧凑，便于⾃动化设备集成

■ Adoption of high performance 355nm UV laser, superior quality for laser beam with tiny spot, suitable for superfine marking.

■ Selection for rotary double station table and split structure.

■ Adoption of air- cooling system under 5W (contained) , easy for integration, small size, especially suitable for flying industry.

■ Applied to fine marking, precise cutting, and precise processing of special material, mainly used for these materials, such as all kinds of glass, LCDscreen, textiles,chip ceramicm, semiconductor, IC grain, sapphire, thinpolymer film and etc.